WELDING RESEARCH NOVEMBER 2016 / WELDING JOURNAL 449-s ed with the diffusion soldering method. The results indicated that directly electroplating a 3-m Sn interlayer on the Pd sheet and diffusion soldering with the Ni plate completely exhausted the Sn film and caused Ni3Sn4 and PdSn intermetallic compounds to form, respectively. Unfortunately, a long crack appeared at the Ni3Sn4/PdSn interface, resulting in a very low bonding strength. Inserting a 3-m Ag layer between the Pd sheet and Ni plate, both coated with 4-m Sn, caused an additional Ag3Sn intermetallic compound to form between the Ni3Sn4 and PdSn intermetallic layers and prevented cracking of the Pd/Ni joint. Satisfactory bonding strengths ranging from 10.6 to 17.3 MPa were achieved with diffusion soldering at temperatures between 275º and 350ºC for 30 min using such Sn/Ag/Sn interlayers. 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Welding Journal | November 2016
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