WELDING RESEARCH Fig. 5 — The thickness (X) of PdSn4 and Ni3Sn4 intermetallic compounds formed during diffusion soldering of the Pd/Ni couple at various temperatures for 30 min using Sn interlayers (Case I). A B C D a double layer of 4-m Sn/3-m Ag and then assembled respectively with a Sncoated Ni plate similar to that in Case II. Diffusion soldering was conducted in a vacuum furnace of 5.3 10–4 Pa, and the assembly was heated at various temperatures 444-s WELDING JOURNAL / NOVEMBER 2016, VOL. 95 between 275º and 350ºC for 30 min under a pressure of 3 MPa. After the bonding processes, the specimens were cross sectioned, ground with 4000-grit SiC paper, and polished with 1- and 0.3-m Al2O3 powders. The microstructures of the intermetallic compounds that formed at the interfaces were observed with scanning electron A B Fig. 6 — Microstructure of the Pd/Ni couple diffusion soldered at various temperatures for 30 min using Sn/Ag/Sn interlayers (Case II): A — 275°C; B — 300°C; C — 325°C; D — 350°C.
Welding Journal | November 2016
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