Showcasing Fujifilm's core technologies and products developed by integrating these technologies.
Bring your favorite images from smartphones and social media to life, through prints, personalized and wall decoration photo products, and unique DIY photo creations. FUJIFILM is the global leader in the formulation, manufacture and marketing of premium inks. A Premium, label free, low odour, low VOC, aromatic free, emulsifiable Screen Wash suitable for UV, Water Based and some solvent based ink types. Pyramid Screen Products endorse best industry practice that operators should wear appropriate personal protective equipment (PPE) when handling all chemical products, even those classified as 'non-hazardous'.
PEC for LED interconnection18 January 2010PCB mounting of LEDs has so far been limited to mechanical interconnection or the use of PCBs built on thermally conductive copper clad aluminum substrates. To learn more about what wea€™re about, please explore Innovation at the Fujifilm global website.
We market a broad array of leading edge, high productivity inks for short term and long term use. The cloth offers small window openings between the weave patterns where the filled epoxies can make contact with both the copper foil and the aluminum to transfer heat.
Additionally the existing available thermal prepregs are thicker at 100 microns, which increases the effective thermal resistance limiting the maximum watts per square inch dissipation. A PCB manufacturer would use this laminate material, laminating photo-imageable etch resist, exposing with UV light, then developing to form a circuit image, before etching away unwanted copper to produce circuit traces. Alternatively, they could used by selectively printing both the dielectric and conductive traces to make a thermally conductive circuit by anyone with a silk screen printer and a thermal oven, (figure.3).
Using CCD-120A Thermally Conductive Dielectric ink with its nano technology enhanced formulation in making PCB boards or even making copper clad aluminum circuit laminate, will deliver lower thermal resistance than that of other currently available copper clad aluminum substrates.Copper clad aluminumThe thermally conductive B stage ink is applied to either the surface of the copper foil or of the aluminum, and is semi cured (B-Stage) using a thermal oven.

Application is typically a silk screening operation to deposit a thin film of thermal ink approximately .001in thick. The end result is a thin layer only 25 microns thick of the thermal material sandwiched between the copper and aluminum.
With this version of a copper clad aluminum, the B stage thermal ink offers lower thermal resistance, because of the surface area contact and the thickness of the deposit. As well as this, the pressure of the lamination cycle constricts the ink, allowing a closer contact between thermally conductive ceramic particles increasing the thermal conductance. Processing the panel to make a simple single sided circuit is done by a time honoured print and etch method requiring PCB fabrication equipment and waste water treatment facilities because of the copper etching process.Figure 2 shows the etched circuit trace paths on the Thermally Conductive dielectric, which has a hard surface due to its high ceramic content, but can accept a coat of soldermask before the final cure. A compatible solder mask could later be applied.Print only circuits A selectively deposited thermal conductive ink on the aluminum offers the benefit of being deposited only where thermal heat transfer is needed, reducing consumables costs when compared to the currently popular copper clad aluminum substrate, which has full coverage of the underlying surface with the glass cloth impregnated with heat conductive material.
The net result is that by using a thermal ink selectively applied under the silver traces, less of the thermal material is used for the same overall area, yet it will deliver better heat transfer capability because it is thinly applied.Building a printed circuit utilising the print only process can not only simplify the manufacturing, but it will also reduce costs. The silver ink is then cured at 150°C for 30 minutes which fuses the silver trace into a solid metal track. A compatible solder mask can be applied and tack dried, followed by an overall full encompassing cure of 300°F for 60 minutes which forms the final circuit.
As there is no requirement to etch, and therefore no need to mask off the aluminum when etching or processing, labour is reduced.
When using the silver ink trace technology, assembling and soldering the components requires a lower temperature solder, which is typically used in assembly houses. The thermal characteristics are vastly improved over that of a normal copper clad aluminum etched type circuit. Clearly evident is the larger amount of exposed aluminum made possible with an all printed version of the board and the resulting superior heat dissipation available.Printed Electronics versatilityUsing ink technology, more complex circuit boards can be manufactured by using the more advanced and green PEC (Printed Electronic Circuit) technologies.

By silk screen coating the aluminum with thermally conductive dielectric, a second layer of a specially formulated LPI dielectric ink is deposited at some 1 to 1.2ml thickness depending on screen mesh selections.
Tack cured and then exposed using ordinary UV exposure units, the LPI is spray developed on typical developing equipment and chemistry.
A thermally conductive PEC’s third component is a nano technology silver conductive ink which is applied onto the surface of the LPI.
The ink fuses into a solid mass with a slight deposit on the surface of the LPI, which is easily removed. The next step is a repeat of the second, except that this interconnection layer will be a via formation layer only. Because the LPI is never stripped off and the entrenched silver conductive ink is level with the top of the LPI, everything conductive is flush to the dielectric.
The result is that the interconnect vias are buried and is a 100% metal connection to the first layer. Versatile, boards can be configured to use the PEC full additive process even on two sides of the aluminum if desired, or build multilayer circuits on one side of the aluminum backing. Figure 7 shows a typical PEC build configuration; a multilayered single sided thermally conductive PEC technology PCB board. Designs could be altered a number of ways allowing for many new interconnect possibilities.Using printed electronic ink products and processes to manufacture high performance thermally conductive circuit boards offers clear advantages in manufacturing flexibility, performance and cost.

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Comments Uv screen printing ink formulation chemist

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