17.05.2016
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This amount includes seller specified US shipping charges as well as applicable international shipping, handling, and other fees. Estimated delivery dates - opens in a new window or tab include seller's handling time, origin ZIP Code, destination ZIP Code and time of acceptance and will depend on shipping service selected and receipt of cleared payment - opens in a new window or tab. This item will be shipped through the Global Shipping Program and includes international tracking. International Shipping - items may be subject to customs processing depending on the item's declared value. Your country's customs office can offer more details, or visit eBay's page on international trade. Will usually ship within 1 business day of receiving cleared payment - opens in a new window or tab. Will usually ship within 3 business days of receiving cleared payment - opens in a new window or tab. The user does not accept the negative feedback, if the item received or not received, the project if the errors or defects, please contact me e-mail feedback, we will give you a satisfactory solution, thank you! By submitting your bid, you are committing to buy this item from the seller if you are the winning bidder. By clicking Confirm, you commit to buy this item from the seller if you are the winning bidder. By clicking Confirm, you are committing to buy this item from the seller if you are the winning bidder and have read and agree to the Global Shipping Program terms and conditions - opens in a new window or tab.


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In addition, these materials improve individual component insulation, minimizing current loss. Tangent Industries produces single component, light curable encapsulants with performance properties that are ideal for high volume production lines.
Tangent Industries offers single component, light curable potting materials that are specifically formulated to act as barriers against contamination, chemicals, moisture, and handling damage. Tangent’s broad selection of potting materials bond to a variety of substrates including ABS, nylon, polycarbonate, and plated metals. View the adhesive selections listed below for a possible candidate for your potting application. If you'd like to get the additional items you've selected to qualify for this offer, close this window and add these items to your cart.
Packaging should be the same as what is found in a retail store, unless the item is handmade or was packaged by the manufacturer in non-retail packaging, such as an unprinted box or plastic bag.
Contact the seller- opens in a new window or tab and request a shipping method to your location. You have read and agree to the Global Shipping Program terms and conditions - opens in a new window or tab. Import charges previously quoted are subject to change if you increase you maximum bid amount. Encapsulated components are shielded from environmental stresses, contamination, and mechanical vibration.


The encapsulating materials are deposited directly on the components and boards in precise, repeatable patterns. The materials are highly resistant to contaminants, cure with minimal shrinkage, and remain extremely flexible to minimize risk of damage to fine wire leads and connections.
Panacol-Elosol GmbH is part of the Honle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years. Please contact Tangent to confirm your product selection and to secure additional application assistance, including samples and process recommendations.
These materials dispense easily, cure quickly, and provide a protective surface that is dry and tack-free. If you reside in an EU member state besides UK, import VAT on this purchase is not recoverable. Tangent’s encapsulating materials serve to neutralize dissimilar Coefficient of Thermal Expansion (CTE) values between the component and board. Flip-Chips, semiconductor die chips, delicate lead wires, etc.), are shielded from environmental stresses, contamination, and mechanical vibration.
In the event that these standard products do not satisfactorily address your performance requirements, Tangent will investigate other solutions that include development of adhesive specifically tailored to the complexity of your application. Tangent’s encapsulating materials serve to neutralize dissimilar Coefficient of Thermal Expansion (CTE) values between the component and board.



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