12.07.2016
Ultraviolet and electron beam technology offers many benefits for PSAs, including environmental and application advantages. Electron beam technology has been used for many years in pressure-sensitive adhesive applications.
Initial reports on the use of ultraviolet (UV) and electron beam (EB) technology for pressure-sensitive adhesives (PSAs) began to appear in the late 1960s.
EB PSAs may exist in a variety of forms, including: syrups, solvent-based, water-based, and hot- or warm-melt-based systems. Advanced research in EB processing showed the possibility of forming pressure-sensitive materials by irradiation of monomers directly on a substrate. The enhancement in PSA performance resulting from EB irradiation is clear in these references. Commercial self-shielded electron beam processors have been available for more than 30 years. Electron beam processes are characterized by the dose, throughput and accelerating voltage of the systems. The accelerating voltage of the electron beam determines the penetration into the material being processed. A new generation of lower energy EB processors was introduced about 10 years ago.9 This equipment operated in the range of about 90-125 kV, which is well-suited for the EB curing of coatings and inks for printing and packaging applications. The Handbook of Sealant Technology provides an in-depth examination of sealants, reviewing their historical developments and fundamentals, adhesion theories and properties, and today’s wide range of applications. UV LED curing technology is ideally suited for the wood coatings industry for applications such as edge coating, roller coating and digital printing. FireLine and FireJet that are ideal for wood coating and can scale to cover any conveyor width. Industrial processes require products that can work in tough, sometimes harsh environments. Phoseon Technology is the leader in UV LED curing solutions for commercial and industrial applications. Enter company name or related keyword in search box and we will find best suggestions around the web for you. DYMAX Light-Weld UV curable glass bond assembly adhesives cure in seconds upon exposure to ultraviolet light. UV cure adhesives are used in the production of glassware, glass furniture, acrylic glass, and for the optical industry and medical technology field.
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Big Frank: How to bond glass simply and safely This video provides directions for how to bond glass simply and safely with Bohle UV-Bonding Technology. With specially developed properties, UV-curing adhesives are suitable for durable, stable bonds for many different materials such as glass-glass or glass-metal.
Lamberti Group is based in Italy and is present in many countries worldwide with subsidiaries and production facilities. Along with the central R&D labs, dedicated to products and process innovation based on core technologies, the several laboratories of the Business Units are focused on products formulation and performance assessment, new products promotion and technical assistance on the market. In this structure, the Photocuring Business Unit with its brand ESACURE produces several photoinitiators (type I, type II, cationics, coinitiators) suitable for many different UV application.


ESACURE KIP 160 In last years Lamberti Photocuring labs developed a new high performing photoinitiator: ESACURE KIP160. It has since been an active area of interest, which indicates continued belief in the technology. This was likely due, in part, to the lower capital cost of UV equipment compared to EB equipment.
Curing involves the polymerization of low-molecular-weight polymer precursors (monomers and oligomers) with reactive (acrylate) end groups.
Syrups are solvent- and water-free liquid systems based on formulated monomers, oligomers, tackifying resins, and additives. The process involves application of the PSA (direct or transfer coated on a release liner). In its simplest form, the process involves extrusion of the hot- or warm-melt adhesive followed by in-line EB irradiation (see Figure 1). A typical EB dose range for curing or crosslinking PSAs is from about 20 to 100 kGy (2-10 Mrads). Industrial low-voltage energy electron beam processors historically operated in the range of about 150 to 300 kV. The 125 kV voltage is also useful for processing adhesive layers up to 50 microns (2 mils) thick. A significant enhancement in hot-melt adhesive properties has been shown in numerous patent references.
UV LED technology drastically reduces energy consumption and significantly reduces work-piece surface temperature. The consistent UV output enables end users to run their production lines at maximum speeds. With its photoinitiators ESACURE ONE, ESACURE 1001M, ESACURE A198 and ESACURE KIP 160, that show low migration and extraction values, Lamberti is betting on Food- Packaging application.
A 2003 study by The ChemQuest Group estimated 1.5 million lbs of UV PSA were being processed annually, with approximately 97% of the volume captive. In addition, PSA suppliers often had UV equipment available but had limited access to EB equipment for development purposes.
This provides the potential to crosslink compositions that are similar to conventional PSAs, helping to reduce the applied cost of the adhesive. Crosslinking involves the creation of covalent bonds between existing high-molecular-weight polymer chains. The solvent or water is then evaporated using a conventional thermal dryer, and the resulting layer is EB crosslinked.
Variations include EB irradiation through a release liner and EB irradiation on a transfer drum.6 Crosslinking of hot-melt PSAs provides improved shear, heat and solvent resistance.
The shear adhesion failure temperature (SAFT) of this adhesive system increased upon EB irradiation at 19 kGy and then shows little additional increase at 29 and 48 kGy.
The adhesive performance of four different polymers (blended with tackifier and plasticizer) are shown with and without EB irradiation.
The adhesive systems in this case are blended with multi-functional (meth)acrylate monomers (coupling agents). EB processors generate accelerated electrons using electrically operated filaments within a vacuum chamber.


Many of these early patents have now expired, which open the possibility for development by merchant adhesive suppliers.
Phoseon's patented SLMĀ® technology provides intense UV output, while using a fraction of the power required with traditional UV arc lamps. In addition, automated processes work well with UV LED curing lamps due to being a solid-state, semiconductor based device that allows for virtually instantaneous on-off or pulsing of the UV energy. These glass bonding adhesives are all one part, so no mixing is required, solvent free and do not emit VOCs during cure. Glass is clear, fragile, and smooth, so gluing it to anything without ruining its appearance can be difficult. Laurence is the world leader, wholesale distributor to the Glazing, Industrial, Construction, Architectural, Hardware and Automotive Industries.
These systems offer advantages including improved process control and pot-life compared to chemical crosslinking systems.
The holding power increased dramatically upon EB irradiation and then continues to increase to over 1,000 min after 48 kGy.
The peel strength of all four polymers is only slightly affected while the lap shear (LSP) shows a dramatic enhancement as a result of EB irradiation. Electrons are accelerated through a thin metal foil window and impinge on a moving web at atmospheric pressure. The availability of new-generation EB equipment operating up to 175 kV should make this technology attractive to a larger number of converters of pressure-sensitive materials. DYMAX UV curing glass adhesives form high-strength, clear, environmentally resistant bonds to glass as well as plastic and metal substrates. This includes uniform energy deposition though the thickness of the adhesive, as well as across the web.
EB also has the potential to provide improved bonding to the substrate through a grafting mechanism. The region above the contour is where no adhesive residue remains upon peeling at 400°F.
It also allows the possibility of irradiation through the substrate or release liner being used in the converting process. They adhere to soft glass, borosilicat DYMAX Light-Weld UV curable glass bond assembly adhesives cure in seconds upon exposure to ultraviolet light. The results show that lower EB doses are effective in maintaining good STL as the amount of coupling agent is increased. There are 2 types of adhesive that are suitable for use with glass: UV glue and silicone sealant. A comparison of hexanediol diacrylate (HDODA) and hexanediol methacrylate (HDODM) coupling agents shows that the acrylate is more effective than the corresponding methacrylate.
The main advantage is for pattern printing (flexo or screen), which may be integrated with other printing or converting processes.
UV-curable syrups are fairly well known;5 however, EB-curable syrups have limited commercial use.



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