17.01.2014
UV curable adhesives are single part, solvent free, cure-on-demand adhesives suitable for a wide range of applications. Their use is widespread, particularly in medical device assembly and the electronics industry.
Save Energy and Space – A UV curing light requires less electricity and space compared to ovens. UV curable adhesives do not dissolve, melt or weaken the surfaces of the mated items or surfaces. UV LED is a new light source that radiates ultraviolet rays and replaces conventional UV lamps for curing, exposure and sterilization. LG Innotek has succeeded in the world’s first mass production of 6-inch wafer for increasing performance and maximizing optical power of UV LED. In all of the following experiments, the baseline was established for the unexposed material and then the shutter was opened to allow the UV light to be projected into the parallel plate geometry. In Figure 2 one notes that UV exposure causes a very rapid reaction rate and the dynamic moduli G’ and G” exhibit a crossover very quickly (on the order of a few second after UV exposure).
In the next post we will discuss the impact of UV intensity and UV dosage on the rheological properties of the UV-curable acrylate pressure sensitive adhesive. Didn’t know what is the right experimental approach to get the right rheological information?
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A strong chemical bond is formed between the two substrates providing a high strength alternative to other curing methods. Its high-performance UV LED packages, applied vertical chip technologies, LG Innotek secured the leadership in the UV LED market.
The dynamic storage moduli plotted as a function of time to demonstrate the effect of sample gap height on the UV curing reaction. Confused about what is gelation or how does vitrification impact thermoset curing profiles?


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These novel resins are designed for use with low thermal conductivity fillers such as hollow glass microspheres or silica aerogel, facilitating a new category of liquid insulation coating that offers low thermal conductivity in an easy spray application. In accelerated UV exposure testing over concrete substrates, a coating formulation made with MAINCOTE™ AEH Hybrid Technology demonstrated inherently better resistance to gloss change under UV radiation. Upon exposure to UV light of the proper intensity and spectral output, these products cure rapidly to form excellent bonds to a wide variety of substrates such as metals, glass and most plastics.
The boom in the electronics industry in the 1990’s, saw the introduction of many exciting new UV curing adhesives, geared to help speed up production lines by giving instant, high-performance bonding results. A UV curable system does not require the addition of curing agents and cures within seconds. The UV-A (315~400nm) range is applied to diverse applications, including industrial applications such as UV curing, exposure, printing ink hardening, counterfeit detection, photo catalyst and specialty illumination for aquarium, agriculture etc., whereas the UV-B (280~315nm) range is used for medical purposes and the UV-C (200~280nm) range is applied to products for air or water purification, and sterilization. Every year many laboratories begin a microfluidic activity and sometimes not with the good equipment or methodology. Or wondered how to measure the glass transition temperature of an epoxy or polyester composite? This tutorial has for aim to bring the basic knowledge on how to do a mold in epoxy resin SU-8.In this tutorial we use a spin coater to dispense the resin but other technics can be used.
We are going to give you here little tips and tricks to make the SU-8 mold fabrication as easy as pushing a button.
Do not hesitate if you have specific questions we always like to help researchers, as we are some too, and we will try to answer as best as possible, if you are interested by doing your own SU8 mold please look at our SU-8 station.Need an advice about SU-8 mold fabrication? The preparation of the waferEven if the wafer is new, it has to be prepared before receiving the SU-8 photoresist. The cleaning can be optional if you are sure about the state of your wafer but it is strongly advised.
This heating step is really relevant because it will allow the SU-8 to stick better on the substrate. If you have some difficulties to spread well the photoresist over the surface or if during the soft bake the photoresist makes some hole in the layer, it means that the photoresist doesn’t wet enough the substrate. A plasma treatment (O2 or Air plasma works fine) during 5 minutes will increase the spreading. At last, even if, with the dehydration step, the photoresist doesn’t stick to the substrate you can use an adhesion promoter which can be deposited by gas such as HMDS or in liquid form and spin coated first on the surface like the Omnicoat.2. The spin coating of the negative epoxy resin SU-8 photoresistTo create the photoresist layer which is later going to be the mold, we use a spin coater. The spin coating is probably the most used technique to create a photoresist layer of a wanted thickness. We describe in more details the spin coating step in our tutorial “how to get the best SU-8 spin coating”. The rotation speed, the acceleration and the SU-8 photoresist viscosity will define the thickness of the SU-8 photoresist layer. The epoxy resin SU-8 soft bake (first baking of the photoresist)The soft bake aim is to evaporate the solvent to make the SU-8 photoresist more solid.
The evaporation will change a little the thickness of the layer and prepare the SU-8 photoresist to be exposed to the UV. We have gathered more information about the relevant parameters to do a good SU-8 photoresist baked in our tutorial “how to get the best SU-8 baking”.


It will depend on the thickness of the layer but keep in mind that the most problematic point will be the mechanical stress inside your SU-8 photoresist.
Use a hot plate to bake your SU-8 photoresist, it will allow you to have a heat from the bottom to the top of your wafer and thus favorize the solvent evaporation.
To do a progressive heat we advise you to follow a special heat pattern , with a first plateau at 65°C then a second at 95°C, the time of each plateau depending on the thickness of the SU-8 photoresist layer. At the end of this step, the wafer can be kept in dark and on a flat surface during several weeks before continuing and finishing the process without serious consequences.4.
The epoxy resin SU-8 edge bead removalThe edge bead removal step consists in removing the photoresist edge bead around the wafer after the spin coating. Because of it the photoresist layer is thicker at the edge and the height namely depends on the photoresist viscosity.
Especially for very viscous photoresists, where the edge bead can rise several µm, it has to be removed. Indeed, the edge bead prevents the mask to be as close as possible of the wafer during the exposure step and this gap will lead to a resolution loss in the design. Usually the edge bead removal is done by injecting acetone forward the edge of the substrate when it is rotated at high speed. The spin coating of the negative epoxy resin SU-8 photoresistThe aim of the exposure is to initiate the cross linkage by the activation of the PAC (PhotoActiv Component) in some parts of the photoresist. This activation will change the local properties of the resin which, after baking, will be soluble or not into a solvent.
Since the SU-8 is a negative photoresist, it means that the part exposed to the UV light will become hard and the other part will dissolve during the development. The epoxy resin SU-8 post exposure bake (second baking of the photoresist)The second photoresist bake is called PEB (Post Exposure Bake). The UV exposure enables the activation of the photoactive components in the SU-8 photoresist but it needs energy to continue the reaction; this bake brings that energy. As for the soft bake, the most problematic point will be the mechanical stress inside your SU-8 photoresist and thus the heating and cooling down will have to be done slightly to decrease as much as possible this stress. The heating pattern is the same as in the soft bake, a first plateau at 65°C then a second at 95°C, the time of each plateau depends on the thickness of the SU-8 photoresist layer. The development of the negative epoxy resin SU-8 photoresistThe development is the step where the non linked SU-8 photoresist is diluted in solvent. The epoxy resin SU-8 hard bake (third baking of the photoresist)The third and last photoresist bake is called “Hard bake”, it is the last step of the process but can be optional.
A lot of strengths remain inside the SU-8 photoresist at the end of the process that can create cracks on the surface or even delamination of the layer… The Hard bake heats the SU-8 photoresist at high temperature (more than 120°C) to suppress these strengths.
Once again, it’s the same as in the soft bake and PEB, the increase and cooling down of the photoresist have to be done slightly.9. The checking measuresAt this step the SU-8 mold is already finished but we have to check if it’s fitting with expectations. Then you can use optical or a mechanical profiler to measure the depth of the layer.Congratulation your have done your SU-8 mold!



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