3M provides tape and adhesive solutions for attachment, bonding, fastening, joining, security, product indentification and protection, to meet the requirements of the electronics industry. Rolls of pressure sensitive adhesive pre-applied to a special release liners available with a variety of adhesive properties, including high tack, high temperature resistance and adhesion to low surface energy plastics. A thermosetting film adhesive designed for adhering stiffeners to heat spreaders and also stiffeners to organic substrates such as polymide flexible circuit tape (TAB), and BT Resin in Integrated Circuit Packaging. High performance electrically conductive adhesive products that can be used to mechanically and electrically bond flexible circuits. 3M Bonding Films are thermoplastic films that reach up to 900 psi shear in seconds to speed assembly. 3M Clean Seal Tapes are used in the manufacturing of hard disk drives and related electronics products.
Adhesives coated on both sides of paper, film and tissue carriers to increase the dimensional stability of the adhesive for easy handling and application. 3M™ Foil Tapes with high performance pressure sensitive adhesive that can manage electromagnetic interference from internal and external sources.

2-part epoxy elastomer for reusable gasketing and contamination barrier on hard disk drive covers.
These tapes provide masking protection to key areas of Printed Circuit Boards during wave sodering and chemical bath processing.
These tapes are printable and die cuttable; making them well suited for label and identification applications. 3M Pressure Sensitive Label Materials designed to survive challenging environments and manufacturing processes. 3M Liquid Structural Adhesives are load-bearing formulations for bonds often as strong as, or stronger than the materials joined. 3M™ Optically Clear Adhesives (OCA) are highly specialized optically clear free-film adhesive offering superior clarity and excellent adhesion to various types of transparent substrates.
Removable pressure sensitive film tapes to protect products from scratching, marring, and chipping during production and shipping. These tapes and films provide high thermal conductivity by focusing on the two areas that matter most: bulk conductivity and interface conductivity.

3M™ Viscoelastic Damping Polymers have different damping temperature ranges and can be used in a variety of electronic industry applications. 3M™ introduces the “Next-Generation” of adhesive technology, designed to improve your IC packaging and assembly processes.
Unique all-acrylic foam construction provides extremely high bond strength to many surfaces under demanding environmental conditions.
Their superior depth of cure, rapid cure speed and easy dispensability can save valuable processing time in both UV and visible light curing assembly environments.
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